Welcome

Following the successes of the previous three international Conferences on ALD Applications and China ALD Conferences since 2010, the 4th International Conference on ALD Applications & 2018 China ALD Conference will be a four-day meeting, dedicated to the fundamentals and applications of Atomic Layer Deposition (ALD) technology in various fields. It will be held in Shenzhen, China, from October 14 to 17, 2018. This conference will feature plenary sessions, oral sessions, poster sessions and industrial exhibitions.

The ALD technique has been widely used and explored in numerous fields such as microelectronics, photoelectronics, optical coating, functional nanomaterials, MEMS/NEMS, energy storage, biotechnology, catalysis technology, and etc.        More>>

 

 

PROCEEDING AND FULL PAPER:

Full contributed papers will be peer reviewed and published in a special issue Nanoscale Research Letters ((2018 impact factor: 3.125)

 https://nanoscalereslett.springeropen.com/aald 

More>>
Sponsors

 

                                      

                                   

                          

 

                               

 

                                                               

Important Dates

    Abstract Submission Ends
    Sept. 15, 2018

    Sept. 25, 2018

    Please submit your abstract for Oral or Poster presentation
    via http://www.c-ald.com (click here)

     

    Preregistration Opens

    July 15, 2018

News

© Fudan University & Peking University Shenzhen Graduate School

Powered by : WeiCheng